Micron is Hiring | AutoCAD Engineer – Package Design | BE/ BTech/ BS in Electrical/ Mechanical Engineering |
Position – AutoCAD Engineer – Package Design
Micron
Location – Hyderabad, Telangana
Exp. 4+ years
Job description
- As an AutoCAD Engineering for ASIC design, you will join a team chartered with designing, implementing, and verifying products that fuel Micron’s growth in system-level memory solutions. Micron is expanding quickly in various segments of the Solid-State Drive market, managed NAND solutions for mobile applications and other emerging memory and system-level technologies. Efficient, high-quality implementation and verification of system on chip ASIC designs is a key component of Micron’s success in these products. This role resides in the Central Engineering organization and will require close communication and collaboration with ASIC Architecture, Verification, and Implementation teams on needed tools and capabilities. Below is a list of qualifications and experience ideal candidates will possess.
- Create Design drawings for the IC Packages
- Drafting and Detailing of Bond Diagrams, Package Outline Drawings, Mark Template drawing, Lid drawing, Stiffener drawing, Interposer Drawings, and Wire Bond Diagrams &Other Manufacturing drawing is the added advantage.
- Responsible for fixing the KOZ region for stiffener and lid packages.
- Execute advanced package design reviews in a timely and efficient manner
- Perform direct design reviews with assembly Subcon design teams
- Participate in the DFMEA (Design for Manufacturing) process
- Maintain familiarity with document workflows and signoff flows
- Ensure accurate and timely update of all documents into the Assembly Database
- Check and proofread designs from different areas (interposer suppliers, sub cons drawings, tooling vendors, etc.
Qualifications
- Knowledge and proven ability to communicate complex AutoCAD design with 2D and 3D Design Drafting and Detailing (GD&T)
- Demonstrated strong written and verbal communication skills
- Advanced understanding of licensing utilization strategies and standardized design environments including foundry PDK integration
- Knowledge of IC Package Design Process Cycles is the added advantage
- Knowledge of creating Bond Diagram, Package Out Line drawing, Mark Template drawing, Lid drawing, Stiffener drawing, Other Manufacturing drawing is the added advantage
- Knowledge of fixing the KOZ region for stiffener and lid packages.
- Understanding of database management methods and version control techniques
- Understanding of automated regression and continuous integration workflows
- Knowledge of software development techniques and automation implementation will be the noticeable one
- Should have good knowledge of manufacturing processes
- Education and Experience:
- Required: BS in Electrical / Mechanical Engineering or equivalent
- Preferred: Five or more years of experience in Auto CAD Design Engineering, Design Drafting and manufacturing Drawing Generation or CAD operations
