Intel is Hiring | Thermal Design Engineer |

Position – Thermal Design Engineer
Company – Intel
Location – Bengaluru, Karnataka, IN

Job description

Job Description

Are you passionate about computer graphics and disrupting the industry with your innovations? Working with leading engineers on Intel’s latest GPU/CPU architecture? Do you love collaborating with diverse teams, customers, and design partners to help achieve Best–In-Class visual experiences that enable users to immerse themselves in a new visual future? If you answered yes to any of these questions, then our IAGS organization has opportunities for you. In IAGS we deliver Intel’s integrated and discrete GPUs, which include 3D graphics, multimedia/video, 4K+ display, and parallel computing technologies. Our Platform Architecture and Engineering (PAE) team drives the platform solutions for Intel’s entry into market segments served by high performance discrete graphics processors and hardware.

The Discrete Graphics Platform Architecture and Engineering (PAE) team is hiring multiple roles with diverse expertise in our Bangalore office. As a member of this team we are looking for expertise in the area of Thermal & mechanical design.

Your responsibilities will include but not be limited to:

• Thermal development of advanced, high performance, cost effective, quiet and reliable thermal solutions for Intel’s discrete graphics chips.
• Drive the design of high performance and unique form factor thermal solutions for Intel graphics cards
• Works with technology partners to drive advanced cooling technologies
• Interacts with the Board design, the board layout, board validation and other associated teams on requirements and solutions
• Works on thermal solution for both notebook and add-in-card products
• Enables thermal design guidelines to customer for graphics products
• Interfaces with customer teams on thermal solutions reviews and support

Qualifications

• Bachelor’s /Master’s degree in Thermal / mechanical Engineering
• Minimum 5+ years of experience in thermal design
• Candidate should have strong basic in system thermal cooling solutions and designs
• Experience in modern thermal/mechanical simulation and modeling, and advanced acoustics
• Experience delivering reliable, cost effective thermal solutions
• Demonstrated designs that balance mechanically reliability, aesthetic and active cooling solutions
• Experience working with regulatory and compliance validation for consumer electronics
• Experience in Flotherm/ Icepak tools
• Strong analytical ability, problem solving and communication skills
• Ability to work both independently and in a team environment

Advantages

• Experience in delivering PCIe compliant cooling solutions for products from sub 50 watts to greater than 300 watts.
• A demonstrated passion to deliver highly competitive, uniquely attractive, show case products.

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